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TMCNet:  Inspur and Intel Jointly Launches the First High-Density Cloud-Optimized Four-Socket Platform for CSP Market

[March 14, 2019]

Inspur and Intel Jointly Launches the First High-Density Cloud-Optimized Four-Socket Platform for CSP Market

SAN JOSE, CA, March 14, 2019 /PRNewswire/ -- On March 14th at the OCP Global Summit, Inspur, a leading global data center infrastructure provider, and Intel, a leader in the semiconductor industry, jointly announced the plan to contribute a High-density Cloud-optimized platform to the OCP Community, code name "Crane Mountain".  This four-socket platform is a high-density, flexible and powerful 2U server, validated for the Future Generation Intel® Xeon™ Scalable Processor (Codename Cascade Lake), and optimized with Intel® Optane™ DC persistent memory.  It is designed and optimized for cloud Infrastructure-aaS, Function-aaS, and Bare-Metal-aaS solutions.    

Inspur's NF8260M5 system is being used by Intel as a lead platform for introducing the "high-density cloud-optimized" four-socket server solution to the cloud service provider (CSP) market.  Inspur and Intel plan to work together to define the quality standard that meets top CSP datacenter requirements including but not limited to server hardware, firmware, BIOS and software.  The new system is optimized to run large-scale applications such as data processing, virtualization, and network load balancing. 

As a result of its latest engineering collaboration with Intel, Inspur's NF8260M5 is fully optimized with Intel® Optane™ DC persistent memory.  Inspur's recent benchmark on the SAP 4-Socket HAHA presents better performance gain as compared to conventional DDR4 echnology.   

Adopting a four-socket platform rather than the dual socket presents some key values and incentives to cloud service providers.

With the explosion of cloud application usage, reducing power consumption becomes a major task for any data center operator. A four-socket system presents a significant boost to energy-efficiency as compared to the scale-out dual-socket system.  Recent comparison showed that one four-socket system can reach double digit TCO savings in cloud workload when compared to two dual-socket systems.  Other benefits of four-socket adoption are lower maintenance costs, savings in software license fees, and reduced risk of hardware failure. 

Inspur has over a decade years of experience in developing four socket and eight socket platforms since the release of Intel's 2-socket Thurley platform. Inspur's NF8260M5 is a state-of-the-art system developed over multiple generations of the four/eight socket design.  Its compact 2U form factor delivers the energy-effectiveness to enable the highest number of single rack cores in the industry, which is 2240 cores in a single 42U rack.  By supporting Intel® Optane™ DC persistent memory, a single NF8260M5 2U platform can support up to 18 terabytes of memory or up to 360 terabytes in single 42U rack.  The server can support up to two 2000W power supplies for increasing redundancy and reducing unnecessary downtime.  With support for up to eight PCI-E expansion cards, including graphic processor units and network adapters, the NF8260M5 offers increased expandability and capability to support a robust spectrum of applications. 

About Inspur

Inspur is a leading global provider of cutting-edge data center and cloud computing solutions, ranking among the world's top 3 server manufacturers. Inspur delivers cutting-edge computing hardware design and extensive product offerings to address specific workloads and data center environments in open computing, cloud computing, AI and deep learning. To learn more, please visit www.inspursystems.com.

Cision View original content:http://www.prnewswire.com/news-releases/inspur-and-intel-jointly-launches-the-first-high-density-cloud-optimized-four-socket-platform-for-csp-market-300812799.html

SOURCE Inspur Electronic Information Industry Co., Ltd


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